Engineered Conductive Materials (ECM), a global supplier of conductive interconnect materials for photovoltaic applications, has introduced a new fast-curing conductive adhesive, CA-100.
The adhesive is designed for stringing and bussing next-generation copper indium gallium diselenide (CIGS) solar modules. According to the company, the adhesive's material formulation is optimized for excellent conductivity and stability on molybdenum and other substrates used in thin-film manufacturing.
CA-100 is suitable for manufacturing semi-rigid glass-backed modules and is not designed for flexible modules utilizing reel-to-reel manufacturing, the company adds. The material can be partially cured for 60 to 90 seconds, providing enough ‘green strength’ to withstand induced stresses from the manufacturing process until the adhesive cure is completed during the encapsulant lamination process.
CA-100 also has optimized rheology for dispensing, excellent damp heat resistance and conductivity stability on molybdenum, tin, tin-silver and silver-plated ribbons, ECM says.