Precision Process Equipment Releases Flexible Substrate Plating Technology

Posted by SI Staff on September 26, 2008 No Comments
Categories : Products & Technology

Precision Process Equipment has introduced its Excellite FSP flexible substrate plating technology for photovoltaic manufacturing.

The company says Excellite FSP is a roll-to-roll, continuous-strip electroplating and wet processing system. It uses a three-axis automated wafer transport system that handles all chemical processes in the rear and all rinsing in the front. This design results in a footprint half the length of conventional linear systems, saving clean-room floor space, the company says. The Excellite is available in single or multiple robot configurations.

Precision Process Equipment: (800) 707-3433

SOURCE: Precision Process Equipment

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