Schmid Group Introduces TinPad System For PV Cell Busbar Application

Posted by SI Staff on May 16, 2012 No Comments
Categories : Products & Technology

Schmid Group has released the TinPad system, which is designed to reduce the costs of applying busbars to six-inch solar cells. Delivery of the first TinPad systems is expected for September.

Using tin instead of silver in PV cell production can allow manufacturers to reduce costs, but previous methods to do so have been unsuccessful due to tin's insufficient adhesion to aluminum, the company says. The new TinPad technology allows for the production of silver-free backside contacts with peel-off strength that is twice as high as required.

According to Schmid Group, by using tin instead of the conventional silver/aluminum paste, manufacturers can realize a savings of $0.06 per wafer. The new backside architecture also increases cell efficiency by approximately 0.2%, the company adds.

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