ACI-ecotec Introduces ecoSplit-IXL Wafer Separating System

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ACI-ecotec GmbH & Co. KG has released the ecoSplit IXL, an inline system for separating pre-cleaned solar wafers for final cleaning. The product features an output capacity of at least 3,000 wafers per hour, and a patented gentle separation technology that makes it possible to reduce breakage rates to a low as 0.1% as well, the company says.

The system is based on the ecoSplit C carrier-splitter, which is the world's first fully automated wafer separator, according to ACI-ecotec. The ecoSplit is suitable for separating monocrystalline and polycrystalline wafers in all common formats with thicknesses of up to 120 microns.

The system is equipped with two loading stations onto which sawn wafers are placed in stacks of up to 250 pieces after pre-cleaning and manual inspection. The ecoSplit IXL can be loaded while running, thus assuring continuous operation. Coding can be entered for each stack of wafers by means of a scanning system, or with the help of a master manufacturing executive system. Two-lane belt conveyors are used to transport the wafers.

The ecoSplit's technology removes the bottommost wafer from the stack with a roller system and ensures that only one wafer is removed from the stack at a time. After separation, the wafers are fed to individually adapted transport units for cleaning.

ACI-ecotec GmbH & Co. KG: 49 07724934127

SOURCE: ACI-ecotec GmbH & Co. KG

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