ACI-ecotec Premiers Enhanced Wafer-Sawing System

ACI-ecotec GmbH has launched a new generation of its ecoSplit wafer-sawing system, adding features that automate a key processing stage. Stacks of up to 150 wafers are loaded into the machine for separation, and wafers with sawing errors are automatically detected and removed – allowing for continuous operation of the machine.

The ecoSplit solution has a throughput of 1200 wafers per hour (per splitter lane) and very low breakage rates, the company says. It is presently available in two standard configurations: ecoSplit C for carrier-based batch processing, and ecoSplit I for track-based inline processes.

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