Dow Corning, Reis Robotics Develop New Cell Encapsulation Process

A solar cell encapsulation process developed by Dow Corning Corp. and Reis Robotics has passed factory acceptance testing and is now available for commercial use, according to the companies. Additional site testing was conducted on the pilot line at the new Dow Corning Solar Solutions Application Center in JinCheon, Korea, with an unnamed manufacturer of solar power products.

The new technology enables solar panel manufacturers to use Dow Corning PV-6100 Cell Encapsulant Series and Reis equipment to achieve higher production rates for crystalline and amorphous silicon thin-film modules, the companies explain.

The liquid encapsulation process provides a clear laminate to protect each solar cell in a panel and can replace commonly used ethyl vinyl acetate resin. Panel manufacturers can increase efficiency and reduce total cost of ownership through lower processing temperatures and faster throughput, according to the companies. This process also requires lower capital and less factory space.


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