DuPont Microcircuit Materials Launches New Solamet PV Metallization Paste

DuPont Microcircuit Materials (MCM) has introduced DuPont Solamet PV701 photovoltaic metallization paste, its newest generation of metal wrap-through (MWT) technology for back-side interconnected silicon solar cell designs. This product composition enables the manufacture of back-contact cell designs delivering up to 0.4% greater conversion efficiency for solar cells than with other pastes, according to the company.

MWT is a specialized cell structure that transfers the busbars on the front side to the back side, reducing shading on the front side of the cell. The connections are made through holes in the silicon with the same composition as the busbars.

Employed as a via paste and p-contact metallization for backside-tabbing interconnects, Solamet PV701 features excellent electrical contact to front-side silver grid structures, high-mechanical strength, low shunting, high-line conductivity and outstanding solderability as a p-contact metallization, the company says.

SOURCE: DuPont Microcircuit Materials


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