ECM Introduces Sol-Ag Product Line

ECM LLC, based in Delaware, Ohio, has launched the Sol-Ag product line of electrically conductive interconnect adhesives. According to the company, the Sol-Ag series was developed to exhibit rubber-like flexibility that reduces stress in the interconnect bond line, imparts resistance to thermal cycling and increases overall peel strength of assembly.

Sol-Ag Series products also excel in accelerated damp heat conditions when tested to IEC standards, the company adds, and they have demonstrated unchanged electrical performance after 1,000 hours at 85C/85RH on tin-silver and copper surfaces.

ECM LLC: (740) 362-4444

SOURCE: ECM LLC

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