Engineered Conductive Materials LLC, an Engineered Materials Systems Inc. company, has released Sol-Ag DB-1541-L, a one-part, dispensable, rapid-cure conductive adhesive intended to operate as an interconnect for solar cell and module assembly.
DB-1541-L is designed to survive the harsh humidity and temperature-cycling conditioning while maintaining a low electrical contact resistance, the company says. The adhesive is solvent-free for a void-free bond line.
In addition, the material features excellent adhesion to metals and other substrates, as well as stable contact resistance after conditioning, Engineered Conductive Materials adds.
Engineered Conductive Materials: (740) 362-4444
SOURCE: Engineered Conductive Materials LLC
