Engineered Conductive Materials LLC (ECM), a supplier of conductive interconnect materials for photovoltaic applications, has introduced the DB-1588 low-cost conductive adhesive for back-contact applications in crystalline silicon solar modules.
The new line of conductive adhesives is designed to make contact from vias or other conductors in the solar cells to the back contact sheet. According to ECM, the adhesive is stress absorbing to withstand the rigors of thermal cycling and features strong conductive stability to back contact metallizations during damp heat exposure.
The DB-1588 conductive adhesive is designed to cure through the encapsulant lamination and cure process. Its material has a 40% lower cost than ECM's standard silver-filled product, the company adds.