Engineered Conductive Materials LLC (ECM) has introduced the SolAg DB-1541-J, a jet-dispensable interconnect adhesive. The rheology of DB-1541-J is suitable for rapid, high-volume dispensing for solar module interconnects, according to the company.
DB-1541-J offers excellent adhesion to metals and other substrates, ECM adds. DB-1541-J also offers low out-gassing for a void-free bond line and stable contact resistance after conditioning. The adhesive is also designed to survive IEC damp-heat testing.
For more information, visit conductives.com.