Engineered Conductive Materials, a supplier of conductive interconnect materials for photovoltaic applications, has introduced the DB-1569-1 low-temperature curing conductive adhesive. The adhesive is designed for use in organic photovoltaics (OPV) and organic light-emitting diodes (OLEDs).
The material formulation has been optimized for excellent conductivity and stability on various substrates when cured at 80 degrees C or higher, according to the company. DB-1569-1 is more than 90% cured after 30 minutes at 80 degrees C, with a dispensing work life greater than 48 hours (measured as a 25% increase in viscosity), while maintaining optimized rheology for dispensing and excellent damp heat resistance and conductivity stability on tin, tin-silver and silver-plated ribbons.
DB-1569-1 features extreme flexibility that is ideal for flexible applications with high peel strength to withstand the stresses induced in flexible PV and display applications, the company adds.