Engineered Conductive Materials LLC, a global supplier of conductive interconnect materials for photovoltaic applications, has debuted the fast-curing conductive adhesive DB-1590 for use as a solder replacement in crystalline silicon solar modules using thinned silicon and/or plated bus bars.
According to the company, this material formulation has been optimized for excellent conductivity and stability on various substrates when cured at 200 degrees C, while developing sufficient strength to withstand the applied stresses induced by the manufacturing process until the adhesive cure is completed during the encapsulant lamination process.
DB-1590 has optimized rheology for dispensing, excellent damp heat resistance, and conductivity stability on tin, tin-silver and silver-plated ribbons. It also is stable on OSP-treated copper and nickel bus bars, the company adds. The DB-1590 features a rubber-like flexibility that is ideal for flexible photovoltaic applications.
