The Hemlock Semiconductor Group, which includes two Dow Corning joint ventures, has commenced operation of a polycrystalline silicon production facility, with a capacity of 8,500 metric tons, at its Hemlock, Mich., location.
This new capacity, which has been brought online several months ahead of schedule, represents the completion of the first phase of the $1 billion expansion the Michigan site, announced in May 2007. The second phase of this capacity expansion will begin to come online in 2010 and, together with the first phase, will increase the total annual capacity to approximately 36,000 metric tons.
SOURCE: Dow Corning Corp.
