Henkel Corp. has launched Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. According to the company, the material is ideal for high-throughput production processes and applications that dictate high peel strength, such as the assembly of photovoltaic modules.
While solder is arguably the most common electrical interconnect material, its high-temperature requirements make it impractical for certain applications. Fragile, thin, temperature-sensitive substrates are often subject to damage, not only from the requisite soldering temperatures, but also from screen and stencil printing processes themselves. Hysol ECCOBOND CA3556HF resolves these issues with fast, low-temperature curing, Henkel says.
The adhesive is suitable for both crystalline-silicon and thin-film manufacturing. It features high peel and shear strength, stress minimization properties to compensate for CTE mismatches, and a no-mix, one-part formula that reduces operator error and speeds processing time, Henkel adds.
Henkel: (888) 943-6535