Henkel Corp. has unveiled Loctite 3382, a water-debondable epoxy adhesive that bonds to both silicon and the glass and metal mounting substrates used during the ingot sawing process.
Loctite 3382 replaces traditional epoxies that require caustic acids for debonding. This adhesive breaks down easily on exposure to hot water, eliminating corrosive debonding solutions and minimizing silicon waste that occurs during the wafer cleaning process, the company says. Also, the two-part epoxy is pink when cured, so it is easy to distinguish from the silicon ingot and the metal and glass mounting substrates during visual inspections.
Loctite 3382 is packaged in cartridges, pails and drums, and it is fully compatible with current wafer cleaning solutions and processes.