IBM Engineers Develop Recycled Silicon Wafer Process

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According to the Associated Press, IBM Corp. engineers have developed a process for more efficiently removing circuitry from recycled silicon wafers, allowing the company to preserve material – and share that material with the solar industry.

IBM says the process removes circuitry from wafers with an abrasive pad and water, which saves money and leaves the silicon in better shape for reuse. In a silicon-strapped solar industry, a development such as IBM's could help boost material supply.

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