Meyer Burger Technology Ltd., a provider of systems and processes for cutting and handling crystalline silicon and other materials, has acquired 100% of Diamond Wire Technologies (DWT), a Colorado Springs, Colo.-headquartered developer and producer of diamond wire and diamond wire saws.
The two companies had been operating under a market and development cooperation since 2003. The acquisition price was not disclosed. Meyer Burger expects the transaction to be completed in September.
The application of diamond wire for slicing valuable silicon into thin solar wafers complements today's widely used slicing technology using slurry, according to Meyer Burger. The company expects that the use of DWT's technology in combination with the slicing and wire saws from Meyer Burger will allow customers to achieve a reduction of the total costs of ownership in wafering.
SOURCES: Meyer Burger Technology Ltd., Diamond Wire Technology
