Hisco Inc. has signed a distribution agreement with Hosiden Corp., an electronic component manufacturer headquartered in Osaka, Japan.
Hisco says this agreement expands its offerings for photovoltaic panel assembly and installation with the addition of Hosiden's connectors and junction boxes for crystalline silicon and thin-film modules. Hosiden's portfolio of products have received UL and TUV approval and can be customized to meet the design requirements of individual customers.
SOURCE: Hisco Inc.
